Are BGA Soldering Defects Wasting Your Time?
Use XJTAG’s PC tools to rapidly pinpoint faults
- Test BGA packages for soldering defects quickly and easily
- Achieve wide test coverage of your digital circuitry
- Identify open-circuit, short-circuit and “stuck-at” faults
- Easy-to-use PC tool that connects over the JTAG interface
Try it for free
XJTAG makes BGA testing fast and effortless
Faster than X-ray BGA inspection
With XJTAG boundary scan testing you can quickly find BGA soldering defects without needing physical access. Easily control and monitor nets in real time – whether your board has 1 or 50 BGA (ball grid array) devices.
Pinpoint faults without wasted trips to the BGA rework station or an expensive X‑ray machine.
All using just one small connector.
Suitable for your first prototype
It doesn’t matter if a prototype was sent for manufacture before the design was finalised, or if a fluid specification means continual schematic changes. It’s easy to adapt tests to reflect board changes.
XJTAG testing works on boards with hand modifications and no-fit components.
No board firmware required
Quickly confirm the processor’s I/O pins and memory interfaces are working. Check memories and many other peripheral devices are operational, correctly assembled, and free from soldering defects.
All this without having written one line of code.
Recover dead boards
Even if the processor won’t boot, XJTAG’s boundary scan tests will still run if it has a working JTAG interface.
It doesn’t matter if the memory interface is faulty or the clock won’t oscillate.
High Test Coverage
XJTAG can test digital circuits far beyond the JTAG-enabled microprocessor or FPGA. It will check for assembly faults on RAM, flash memory, EEPROMs, logic gates, and devices connected over SPI, I²C or parallel interfaces.
Automated analysis provides statistics on how much of your circuit board can be tested.
Detect PCB assembly faults beneath BGA packages
Test boards without firmware and debug non-booting circuits
No need for a dedicated bed‑of-nails jig
No BGA X-ray Machine? No Worries.
Identify PCB assembly faults easily and at lower cost
- Detect soldering defects on a BGA’s balls without physical access
- Check JTAG-enabled devices, memories, logic & digital peripherals
- No firmware needs to run on the board
- Intuitive interface – little or no training required
- Runs without a test jig
- Find faults that BGA X-ray machines fail to spot
- Boundary scan is supported by all FPGAs, CPLDs & most 32-bit microprocessors
We first chose XJTAG as the most efficient boundary scan test system offering the best value. We have saved significant time thanks to its built-in features, the XJEase programming language with easy to understand syntax, and the large library of non-JTAG device tests. This greatly reduces the time we spend writing boundary scan tests.
The XJTAG boundary scan system is a ‘must-have’ tool for any company developing high value, high complexity, BGA-populated boards. The powerful system is easy-to-use, flexible, contains an extensive library of re-usable functional tests, and, importantly, enables hardware verification to take place without the need to develop specific test software to run on the target board. This has brought an end to the classic arguments between hardware and software engineers blaming each other when a new design does not work.
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